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Huaswin Electronics Co.,Limited
Huaswin Electronics Co.,Limited Rigid PCB, Flexible PCB, Rigid Flex PCB, PCB Assembly, SMT / Through hole Assembly, custom cable assembly manufacturer in China
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Printed Circuit Board Assembly Single Panel Size Customer Required Multilayer UL approved PCBA

Huaswin Electronics Co.,Limited
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Huaswin Electronics Co.,Limited
Country/Region: China
Contact Person:Ms Vicky Lee

Printed Circuit Board Assembly Single Panel Size Customer Required Multilayer UL approved PCBA

Brand Name : HUASWIN
Model Number : HSPCBA1078
Certification : ISO/UL/RoHS
Place of Origin : China
MOQ : 1 sets
Price : Negotiation
Payment Terms : T/T, Western Union, L/C
Supply Ability : 10,000pcs per month
Delivery Time : 15-20 working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box
Material : FR4
Thickness : 1.6mm
Ceretification : ISO9001:2008
Solder Mask : Green
Panel Side : Customer Required
Finished Copper : 1 OZ
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Printed Circuit on Board Assembly Single Panel Size Customer Required Multilayer UL

approved PCBA


FAQ


Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position

Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.


Specifications

1. PCB Assembly on SMT and DIP

2. PCB schematic drawing/ layout /producing

3. PCBA clone/change board

4. Components sourcing and purchasing for PCBA

5. Enclosure design and plastic injection molding

6. Testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 3D Paste Thickness Test

7. IC programing


Quotation Requirement :


Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM





Huaswin specialized in PCB manufacturing and and PCB Assembly


PCBA capabilities:

Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation


Detailed Specification of PCB Manufacturing

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG,
Polyimide,
Aluminum-based
material.

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/
Silver/Tin,
Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling


PCB Assembly services:

SMT Assembly


Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly


Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design


Conformal coating


Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.


Complete box build


Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material


Testing Methods


AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards


In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.

Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing


Quality Processes:


1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949



Product Tags:

printed circuit assembly

      

pcba assembly

      
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